Snapdragon 820 Rumors: Qualcomm to Unveil New SoC Specs Next Week?
A new report has emerged saying Qualcomm will be announcing the details of its soon-to-be-released Snapdragon 820 next week.
A Chinese analyst has published a detailed report on the upcoming Qualcomm Snapdragon 820 processor, including news it will be unveiled at a special press conference on Aug. 11.
Jiutang Pan, a respected analyst with a solid track record in semiconductor technology information, has released what appears to be a presentation on the Snapdragon 820 SoC on Weibo.com.
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According to the report, it will be a FinFET 14nm 64-bit chip with a Hydra CPU core providing a 35 percent increase in performance, and an Adreno 530 GPU with a 40 percent improvement in performance, and 30 percent in improvement in terms of power consumption.
It will also feature an MDM9x55 LTE Cat.10 modem, and include a "dedicated low-power sensor for emerging always-on-use-cases," the report details.
More importantly, the Snapdragon 820 has promised a marked improvement in terms of power and thermal elements, which is a welcome development following reports of the Snapdragon 810 causing smartphones to overheat.
Qualcomm first talked about the existence of the Snapdragon 820 during the 2015 Mobile World Congress in March, and giving some hints about what to expect.
By next week, if Jiutang Pan's report proves true, the new SoC will be unveiled complete with all the pertinent details.
The analyst continued to say that the Snapdragon 820 SoC may be included inside Xiaomi's upcoming flagship handset, the Mi5 Plus, which is rumored to be released at the end of the year.
Assuming other manufacturers will be clamoring for the new System-on-Chip, the Xiaomi Mi5 Plus is likely to be followed by the Samsung Galaxy S7, that's expected to be launched in the first or second quarter of 2016.
